Eco-Friendly NC-559-ASM No-Clean BGA Solder Paste Flux, 10CC Syringe

This environmentally conscious solder paste flux is designed for BGA applications, offering a no-clean solution that ensures high efficiency and reliability. Packaged in a convenient 10CC syringe, it is easy to apply and minimizes waste. Ideal for electronics enthusiasts and professionals seeking to achieve precise and durable soldering. Originating from China, this product combines innovation with a commitment to reducing environmental impact. Viscosity: 99 Graininess: 0.001 Alloy composition: none Active: yes Type: Paste, BGA Solder Paste Cleaning Angle: No-clean Melting point: 250℃ Operating temperature: 250-480 Scope of application: Rework solder paste for CB, BGA, PGA, etc. Manufacture country: China Instructions included: No

manufactureCountry: China