4 Heat Pipe CPU Heat Sink for LGA2011 1366 11501151 1155 1156 Platform Cooling Kit

Feature: 1. With aluminum alloy double tower heat sink, large heat dissipation area. 2. Using 4 heat pipes, high heat dissipation efficiency and fast heat dissipation. 3. Using 9cm cooling fan, which with strong wind and strong heat dissipation. 4. Support temperature control, automatic speed regulation, convenient to use and with good performance. 5. With back plate and bracket, easy to install, suitable for LGA2011 1366 11501151 1155 1156 platform. Specification: Item Type: 4 Heat Pipe CPU Heat SinkMaterial: Aluminum alloy + copper tube Fan Size: Approx. 9 x 9 x 2.5cm 3.5 x 3.5 x 1in Role: CPU heat dissipation. Package List: 1 x Heat Sink1 x Backplane1 x Bracket8 x Screws